Mechanisms of delamination, void defects in electroless plating and nonuniformity in electroplate were introduced.
重点介绍了钻孔中分层 、 化学镀铜中的气泡缺陷、电镀中的镀层不均匀等缺陷产生的机理.
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Single arm type electroplating device: Suitable for extremely small and light articles to electroplate.
单臂式电镀设备: 适用于极小且轻的物品电镀.
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Processing capability of electrochemical deburring technology, its process procedure and structure of electroplate presented.
阐述了电化学去毛刺技术的加工能力 、 工艺过程及电极的结构.
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The tinning process of dry type current transformer is Electroplate Technology.
传统干式电流互感器的镀锡工艺是采用槽镀镀锡技术.
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Electroplate, electrophoresis, spraying paint, gushing out and moulding the indispensable equipment in the trade.
是电镀 、 电泳 、 喷漆 、 喷塑行业中不可缺少的设备.
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